Book DescriptionLEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP
Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, [...]
Book DescriptionMirroring the latest developments in materials, methods, codes, and standards in building and bridge design, this is a one-of-a-kind, definitive reference for engineers.
Product Details
* Hardcover: 800 pages * Publisher: McGraw-Hill Professional; 4 edition (October 26, 2005) * Language: English * ISBN-10: [...]
Book DescriptionMirroring the latest developments in materials, methods, codes, and standards in building and bridge design, this is a one-of-a-kind, definitive reference for engineers.
Product Details
* Hardcover: 800 pages * Publisher: McGraw-Hill Professional; 4 edition (October 26, 2005) * Language: English * ISBN-10: [...]